? semiconductor components industries, llc, 2006 february, 2006 ? rev. 7 1 publication order number: mc10H158/d mc10H158 quad 2?input multiplexer (non ? inverting) description the mc10H158 is a quad two channel multiplexer with common input select. a ?high? level select enables input d00, d10, d20 and d30 and a ?low? level select enables input d01, d11, d21 and d31. this mecl 10h ? part is a functional/pinout duplication of the standard mecl 10k ? family part, with 100% improvement in propagation delay and no increase in power ? supply current. features ? propagation delay, 1.5 ns typical ? power dissipation, 197 mw typical ? improved noise margin 150 mv (over operating voltage and temperature range) ? voltage compensated ? mecl 10k compatible ? pb ? free packages are available* dip pin assignment q0 q1 d11 d10 d01 d00 nc v ee v cc q2 q3 d20 d21 d30 d31 select 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 truth table select d0 d1 q lll x lhh x hxl l hxh h pin assignment is for dual ? in ? line package. for plcc pin assignment, see the pin conversion tables on page 18 of the on semiconductor mecl data book (dl122/d). *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. cdip ? 16 l suffix case 620a marking diagrams* pdip ? 16 p suffix case 648 http://onsemi.com *for additional marking information, refer to application note and8002/d. see detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. ordering information soeiaj ? 16 case 966 16 1 16 1 mc10H158p awlyywwg 1 16 mc10H158l awlyyww a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g= pb ? free package 10H158 alywg pllc ? 20 fn suffix case 775 20 1 10H158g awlyyww 120
mc10H158 http://onsemi.com 2 table 1. maximum ratings symbol characteristic rating unit v ee power supply (v cc = 0) ? 8.0 to 0 vdc v i input voltage (v cc = 0) 0 to v ee vdc i out output current ? continuous ? surge 50 100 ma t a operating temperature range 0 to +75 c t stg storage temperature range ? plastic ? ceramic ? 55 to +150 ? 55 to +165 c c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual str ess limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation i s not implied, damage may occur and reliability may be affected. table 2. electrical characteristics (v ee = ? 5.2 v 5%) 0 25 75 symbol characteristic min max min max min max unit i e power supply current ? 53 ? 48 ? 53 ma i inh input current high pin 9 pins 3 ? 6 and 10 ? 13 ? ? 475 515 ? ? 295 320 ? ? 295 320 a i inl input current low 0.5 ? 0.5 ? 0.3 ? a v oh high output voltage ? 1.02 ? 0.84 ? 0.98 ? 0.81 ? 0.92 ? 0.735 vdc v ol low output voltage ? 1.95 ? 1.63 ? 1.95 ? 1.63 ? 1.95 ? 1.60 vdc v ih high input voltage ? 1.17 ? 0.84 ? 1.13 ? 0.81 ? 1.07 ? 0.735 vdc v il low input voltage ? 1.95 ? 1.48 ? 1.95 ? 1.48 ? 1.95 ? 1.45 vdc 1. each mecl 10h series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibri um has been established. the circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lin ear fpm is maintained. outputs are terminated through a 50 resistor to ? 2.0 v. table 3. ac parameters 0 25 75 symbol characteristic min max min max min max unit t pd propagation delay data select 0.5 1.0 1.9 2.9 0.5 1.0 1.9 2.9 0.5 1.0 2.0 2.9 ns t r rise time 0.7 2.2 0.7 2.2 0.7 2.2 ns t f fall time 0.7 2.2 0.7 2.2 0.7 2.2 ns note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
mc10H158 http://onsemi.com 3 logic diagram v cc = pin 16 v ee = pin 8 select 9 d0 1 5 d0 0 6 d1 1 3 d1 0 4 d2 1 12 d2 0 13 d3 1 10 d3 0 11 1 q0 2 q1 15 q2 14 q3 ordering information device package shipping ? mc10H158fn pllc ? 20 46 units / rail mc10H158fng pllc ? 20 (pb ? free) 46 units / rail mc10H158fnr2 pllc ? 20 500 / tape & reel mc10H158fnr2g pllc ? 20 (pb ? free) 500 / tape & reel mc10H158l cdip ? 16 25 unit / rail mc10H158m soeiaj ? 16 50 unit / rail mc10H158mg soeiaj ? 16 (pb ? free) 50 unit / rail mc10H158mel soeiaj ? 16 2000 / tape & reel mc10H158melg soeiaj ? 16 (pb ? free) 2000 / tape & reel mc10H158p pdip ? 16 25 unit / rail mc10H158pg pdip ? 16 (pb ? free) 25 unit / rail ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc10H158 http://onsemi.com 4 package dimensions ? m ? ? n ? ? l ? y brk w v d d s l?m m 0.007 (0.180) n s t s l?m m 0.007 (0.180) n s t s l?m s 0.010 (0.250) n s t x g1 b u z view d ? d 20 1 s l?m m 0.007 (0.180) n s t s l?m m 0.007 (0.180) n s t s l?m s 0.010 (0.250) n s t c g view s e j r z a 0.004 (0.100) ? t ? seating plane s l?m m 0.007 (0.180) n s t s l?m m 0.007 (0.180) n s t h view s k k1 f g1 20 lead pllc case 775 ? 02 issue e notes: 1. dimensions and tolerancing per ansi y14.5m, 1982. 2. dimensions in inches. 3. datums ? l ? , ? m ? , and ? n ? determined where top of lead shoulder exits plastic body at mold parting line. 4. dimension g1, true position to be measured at datum ? t ? , seating plane. 5. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 6. dimensions in the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). dim min max min max millimeters inches a 0.385 0.395 9.78 10.03 b 0.385 0.395 9.78 10.03 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 ??? 0.51 ??? k 0.025 ??? 0.64 ??? r 0.350 0.356 8.89 9.04 u 0.350 0.356 8.89 9.04 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y ??? 0.020 ??? 0.50 z 2 10 2 10 g1 0.310 0.330 7.88 8.38 k1 0.040 ??? 1.02 ???
mc10H158 http://onsemi.com 5 package dimensions soeiaj ? 16 case 966 ? 01 issue a h e a 1 dim min max min max inches ??? 2.05 ??? 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.10 0.20 0.007 0.011 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 ??? 0.78 ??? 0.031 a 1 h e q 1 l e 10 0 10 l e q 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4. terminal numbers are shown for reference only. 5. the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). m l detail p view p c a b e m 0.13 (0.005) 0.10 (0.004) 1 16 9 8 d z e a b c d e e l m z cdip ? 16 l suffix ceramic dip package case 620a ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension f may narrow to 0.76 (0.030) where the lead enters the ceramic body. 5 this drawing replaces obsolete case outline 620?10. f e n k c seating plane a m 0.25 (0.010) t m l dim min max min max millimeters inches a 0.750 0.785 19.05 19.93 b 0.240 0.295 6.10 7.49 c ??? 0.200 ??? 5.08 d 0.015 0.020 0.39 0.50 e 0.050 bsc 1.27 bsc f 0.055 0.065 1.40 1.65 g 0.100 bsc 2.54 bsc h 0.008 0.015 0.21 0.38 k 0.125 0.170 3.18 4.31 l 0.300 bsc 7.62 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.01 a b a b 16 1 9 8 g 16x d b m 0.25 (0.010) t t 16x j
mc10H158 http://onsemi.com 6 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. ? a ? b f c s h g d j l m 16 pl seating 18 9 16 k plane ? t ? m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01 pdip ? 16 p suffix plastic dip package case 648 ? 08 issue r on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2 ? 9 ? 1 kamimeguro, meguro ? ku, tokyo, japan 153 ? 0051 phone : 81 ? 3 ? 5773 ? 3850 mc10H158/d mecl 10h and mecl 10k are trademarks of motorola, inc. literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082 ? 1312 usa phone : 480 ? 829 ? 7710 or 800 ? 344 ? 3860 toll free usa/canada fax : 480 ? 829 ? 7709 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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